Hardware Museum

Over 20 years of PC history

Logo

AMD Sempron Mobile 3300+

Published: (last update )

Core
Code nameRoma
Base clock2000 MHz
Turbo full / half / single-
Base multiplier10×
Technology90 nm
Transistors76 million
Die size84 mm2
Density0.90 M / mm2
Cores / threads1 / 1
SteppingDH-E6
Cache
L1 data cache64 kB
L1 inst. cache64 kB
L2 cache128 kB
L2 cache typeOn-die, full speed
L3 cache-
L3 cache type-
Instructions
Basic inst.x86, x87, MMX(+), SSE
Extended inst.3DNow!, SSE2, SSE3
Extended inst. 2x86-64
Extended inst. 3
Extended inst. 4
Extended inst. 5
The CPU
Bus typeHT, 1600 MHz, 32 bit
Bus bandwith6 400 MB/s
SocketSocket 754
Package754 pin micro OPGA
Package size40 x 40 mm
Manufacture date7th week of 2006
Voltage1.2 V
TDP25 W
Memory controllerDDR 400, 64 bit
Integrated VGA-
Release date2005
AMD Sempron Mobile 3300+ (front side)

AMD Sempron Mobile 3300+ (front side)

AMD Sempron Mobile 3300+ (back side)

AMD Sempron Mobile 3300+ (back side)