AMD Ryzen 7 7700
Published: (last update )
Note: The MCM package contains 5 nm CPU die (71 mm², 6.5 billion transistors) and 6nm IO die (122 mm², 3.4 billion transistors)
Core | |
---|---|
Code name | Raphael (8C) |
Base clock | 3800 MHz |
Turbo full / half / single | 5300 | 5300 | 5300 MHz |
Base multiplier | 38× |
Technology | 5 nm |
Transistors | 9900 million |
Die size | 193 mm2 |
Density | 51.3 M / mm2 |
Cores / threads | 8 / 16 |
Stepping | RPL-B2 |
Cache | |
L1 data cache | 8 × 32 kB |
L1 inst. cache | 8 × 32 kB |
L2 cache | 8 × 1024 kB |
L2 cache type | On-die, full speed |
L3 cache | 32768 kB |
L3 cache type | On-die, full speed |
Instructions | |
---|---|
Basic inst. | x86, x87, MMX(+), SSE |
Extended inst. | SSE2, (S)SSE3 |
Extended inst. 2 | x86-64, SSE(4.1, 4.2, 4a) |
Extended inst. 3 | AMD-V, AES-NI, AVX |
Extended inst. 4 | AVX2, FMA3 |
Extended inst. 5 | AVX512, SHA |
The CPU | |
Bus type | UMI, 100 MHz |
Bus bandwith | - |
Socket | Socket AM5 |
Package | 1718 pin lidded LGA |
Package size | 40 x 40 mm |
Manufacture date | 47th week of 2024 |
Voltage | - |
TDP | 65 W |
Memory controller | DDR5 5200, 128 bit |
Integrated VGA | Radeon Graphics (2 CU, RDNA 2) |
Release date | 2023 |